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When a component of the current flowing through the circuit of the electronic device, part of the electrical energy converted to heat components, which increased the humidity of the components connected departments. When the temperature rises above a certain level, the components to misuse or damage. In order to avoid the problems described, Silastic system to install the cooling fan, heat pipe mounted directly to the component, in order to force the Cooling system. However, this approach reduces the fan noise and cost competitiveness. Therefore, the cooling method can be used by the high thermal conductivity of the material component of natural convection. Use of natural convection heat generated by the components to the outside part is called the heat sink.bouncy ball manufacturers to understand the heat sink is made ​​of metal material of high thermal conductivity. The integration of multiple fins on a subject, which can be installed in electronic devices.

Strength of the connection between the heat sink and electronic devices are very low and therefore require high-cost and low productivity. If you are using a silicone rubber cooling system, cooling devices and electronic devices can easily interconnect with. Compared to the silicone rubber and any form of any other elastomer, has been more widely used, and widely used in areas that require high reliability and stability, bouncing  ball manufacturers analysis between silicone rubber and other materials with weak force. Among them, silicone rubber paste it into the material, it is impossible in the case of no special device to remove the silicone rubber.And Removed from the device, silicone rubber, silicone rubber itself is destroyed, therefore, can see that the binding force of the silicone rubber.